0.39 inch OLED MICRODISPLAY 640x400 Integrated kit for AR VR

DESCRIPTION

This micro oled display Integrated kit is composed with 0.39 inch micro oled display,15X magnifiering optical priam, and CVBS display driver board, all components well assembled and can be directly used into devices;

The 0.39-inch OLED microdisplay integrated kit, centered on a 640×400 class output configuration and rated at 500 cd/m² luminance, is designed for compact AR/VR headsets and electronic viewfinder (EVF) systems. Built around the HGM0XGA039136A panel, the module combines high pixel density, full-color rendering, and flexible digital video interfacing within a miniature footprint, enabling stable optical performance in near-eye display architectures.

Core Architecture and Design Characteristics

The microdisplay adopts a silicon-based OLED structure with RGB vertical stripe pixel arrangement, achieving a high pixel density of 3255 PPI. This configuration supports fine image granularity, which is essential for reducing screen-door effects in near-eye viewing conditions. The active area of 7.92 × 6.00 mm ensures compatibility with compact optical engines, while the overall module size remains optimized for lightweight system integration.

From an electrical standpoint, the display supports parallel RGB 24-bit and YCbCr 16-bit input formats, allowing seamless interfacing with a wide range of video processing units. The inclusion of progressive scanning further contributes to image stability and reduced motion artifacts, which is particularly beneficial in dynamic AR/VR environments.

GENERAL SPECIFICATION

Signal Processing and Interface Capability

Digital Video Compatibility

The module integrates a versatile digital interface supporting:

· 24-bit RGB input for high-fidelity color rendering

· 24-bit YCbCr input for efficient video transmission

· 16-bit YCbCr (4:2:2) format for bandwidth-optimized systems

This flexibility allows the microdisplay to operate efficiently across different system architectures, including FPGA-based controllers and embedded multimedia processors.

Image Enhancement Functions

A built-in digital signal enhancement engine provides:

· Adjustable contrast control for varying ambient conditions

· 8-bit input with 10-bit grayscale D/A conversion, enabling smooth tonal transitions

· Horizontal and vertical mirror functions for optical path adaptation

These features simplify system-level calibration, especially in binocular AR/VR optical modules where image orientation and uniformity are critical.

Optical Performance in AR/VR and EVF Systems

The high contrast ratio exceeding 10000:1 ensures deep blacks and vivid color reproduction, which enhances perceived image depth in immersive applications. With a luminance level of 500 cd/m², the display maintains sufficient brightness for enclosed optical systems while balancing power consumption.

In EVF applications, the fine pixel pitch of 7.5 μm contributes to sharp edge definition and accurate focus feedback, supporting professional imaging tasks. For AR/VR headsets, the combination of high pixel density and compact size allows efficient coupling with waveguides or lens assemblies.

Integration with CVBS-Based Systems

When paired with a CVBS (Composite Video Baseband Signal) driver board, the microdisplay kit extends its compatibility to legacy and analog video sources. The integrated conversion circuitry enables stable signal translation from analog input to digital panel driving, ensuring:

· Reduced system complexity

· Improved signal robustness

· Simplified prototyping for mixed-signal environments

This makes the kit particularly suitable for rapid development platforms and evaluation systems in both industrial and consumer AR/VR applications.

Mechanical and Environmental Reliability

The module is engineered for demanding environments, with an operating temperature range from -40°C to +65°C. Its compact FPCA structure enhances mechanical flexibility while maintaining signal integrity. Storage tolerance down to -55°C further supports logistics and long-term deployment in varied conditions.

DRAWING

INTERFACE PIN FUNCTION

Conclusion

The 0.39-inch OLED microdisplay integrated kit demonstrates a well-balanced combination of resolution, luminance, and interface versatility. Its compact design, high pixel density, and robust signal processing capabilities make it a reliable solution for AR/VR headsets and EVF systems, where precision, stability, and integration efficiency are essential.